Solder Fatigue Model Update

Announcement about recent and upcoming Sherlock releases. This forum is moderated.
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natalieh
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Joined: 01 Nov 2016, 08:43

Solder Fatigue Model Update

Post by natalieh » 08 Mar 2019, 13:17

As you may know, Sherlock is a valuable solution for quantitative insight into the thermal, mechanical, thermo-mechanical and manufacturing behaviors and reliability of electronic hardware (components, IC packages, printed circuit boards, assemblies, modules, etc.). On rare occasions, the models used within Sherlock require updating so that they reflect today’s technologies. We strive to be transparent with our users about any changes made in Sherlock via Release Notes and personal emails.

Most recently, in Sherlock v6.0, the ceramic chip and leadless ceramic chip carrier models were updated to decrease the variation between simulation and experimental results. You may experience an increase in lifetime predictions with these updated models.

If you have any questions or concerns, please feel free to reach out to our Application Engineering Team (Gil, gsharon@dfrsolutions.com and David, ddang@dfrsolutions.com) at any time.

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