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Snapshots of Sherlock’s Evolution: March Edition

Posted: 15 Mar 2017, 14:32
by natalieh
What is our product development team up to?
Sherlock’s Parts Library Expansion has begun! In version 5.2 (coming to your nearest computer soon!), there will be 200+ patterns (catered to electrolytic capacitors) available to the Sherlock community. As we continue our targeted expansion, this list will continue to capture a larger number of our users’ parts.

We just wrapped up IPC 2581 Support and have been aggressively developing the IC Wearout module and two game-changing analyses: Thermomechanical Analysis and Temperature-based FEA.

What’s the difference between the above-mentioned analyses? Glad you asked!
• The Thermomechanical Analysis provides the ability to capture system-level effects on solder joint reliability during temperature cycling. Examples of system-level effects include mirroring, over-constrained boards, and potting/coating. In all of these cases, there is location-dependent behavior that induces significant strain into the solder joint -- this will in turn greatly reduce lifetime. At this time, no other commercial analysis tool gives users the capability to capture this very real risk.
• Temperature-based FEA allows users to perform mechanical analysis (vibration, shock, bending) over a wide range of temperatures. The effect of drop/shock at cold temperatures (think mobile devices used in Sweden) and vibration at hot temperatures (think electronics on a jet engine) can now all be captured in Sherlock.

If you have any questions about these developments, please feel free reach out via the forum or to me directly!