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Solder Fatigue Model Update

Posted: 08 Mar 2019, 13:17
by natalieh
As you may know, Sherlock is a valuable solution for quantitative insight into the thermal, mechanical, thermo-mechanical and manufacturing behaviors and reliability of electronic hardware (components, IC packages, printed circuit boards, assemblies, modules, etc.). On rare occasions, the models used within Sherlock require updating so that they reflect today’s technologies. We strive to be transparent with our users about any changes made in Sherlock via Release Notes and personal emails.

Most recently, in Sherlock v6.0, the ceramic chip and leadless ceramic chip carrier models were updated to decrease the variation between simulation and experimental results. You may experience an increase in lifetime predictions with these updated models.

If you have any questions or concerns, please feel free to reach out to our Application Engineering Team (Gil, and David, at any time.